Cluster tool for geometric characterisation of electronic and microsystem components and modules under thermal load (geoCharth) (Q3325969)
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Project Q3325969 in Germany
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Cluster tool for geometric characterisation of electronic and microsystem components and modules under thermal load (geoCharth) |
Project Q3325969 in Germany |
Statements
400,000.0 Euro
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500,000.0 Euro
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80.0 percent
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24 November 2020
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31 December 2021
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Technische UniversitätDresden
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Q3394796 (Deleted Item)
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51°2'57.59"N, 13°44'17.30"E
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Clustertool zur geometrischen Charakterisierung elektronischer und mikrosystemtechnischer Komponenten und Module unter thermischer Last (geoCharth) (German)
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Cluster tool for geometric characterisation of electronic and microsystem components and modules under thermal load (geoCharth) (English)
25 October 2021
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Outil de grappe pour la caractérisation géométrique des composants et modules électroniques et microsystèmes sous charge thermique (geoCharth) (French)
6 December 2021
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Clustertool voor geometrische karakterisering van elektronische en microsysteemcomponenten en -modules onder thermische belasting (geoCharth) (Dutch)
19 December 2021
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Strumento cluster per la caratterizzazione geometrica di componenti e moduli elettronici e microsistemi sotto carico termico (geoCharth) (Italian)
19 January 2022
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Dresden, Stadt
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Identifiers
672 / 101005369901
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