No label defined (Q3304569)
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Project Q3304569 in Germany
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | No label defined |
Project Q3304569 in Germany |
Statements
169,058.42 Euro
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211,323.03 Euro
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80.0 percent
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1 March 2016
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31 December 2018
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ICflex Solution GmbH
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17033 - Neubrandenburg
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Die Innovation gründet darauf, mit einem s.g. Horizontal-Plater auf Kundenwunsch geforderte Endoberflächen (Silber, Zinn, Nickel/Gold und s.g. OSP) auf Leiterplattenfolien in einer bisher auf dem Markt nicht verfügbaren Technik abzuscheiden. (German)
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The innovation is based on the separation of finished surfaces (silver, tin, nickel/gold and so-called OSP) on printed circuit board films on printed circuit board films in a technology that has not been available on the market. (English)
24 October 2021
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Identifiers
DE_TEMPORARY_7354
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