Promoting investment in R & D & I in enterprises (Q3304569)
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Project Q3304569 in Germany
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Promoting investment in R & D & I in enterprises |
Project Q3304569 in Germany |
Statements
169,058.42 Euro
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211,323.03 Euro
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80.0 percent
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1 March 2016
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31 December 2018
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ICflex Solution GmbH
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53°32'42.86"N, 13°15'1.58"E
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17033 - Neubrandenburg
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Die Innovation gründet darauf, mit einem s.g. Horizontal-Plater auf Kundenwunsch geforderte Endoberflächen (Silber, Zinn, Nickel/Gold und s.g. OSP) auf Leiterplattenfolien in einer bisher auf dem Markt nicht verfügbaren Technik abzuscheiden. (German)
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The innovation is based on the separation of finished surfaces (silver, tin, nickel/gold and so-called OSP) on printed circuit board films on printed circuit board films in a technology that has not been available on the market. (English)
24 October 2021
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L’innovation repose sur le fait de séparer les surfaces finales (argent, étain, nickel/or et s.g. OSP) sur des feuilles de circuits imprimés, selon une technique jusqu’à présent indisponible sur le marché, avec un panneau horizontal à la demande du client. (French)
6 December 2021
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De innovatie is gebaseerd op de scheiding van afgewerkte oppervlakken (zilver, tin, nikkel/goud en zogenaamde OSP) op printplaatfilms op printplaatfilms in een technologie die niet op de markt beschikbaar is. (Dutch)
19 December 2021
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L'innovazione si basa sulla separazione delle superfici finite (argento, stagno, nichel/oro e cosiddetto OSP) su pellicole per circuiti stampati su pellicole per circuiti stampati in una tecnologia non disponibile sul mercato. (Italian)
18 January 2022
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La innovación se basa en la separación de superficies acabadas (plata, estaño, níquel/oro y denominado OSP) en películas de circuitos impresos en películas de circuitos impresos en una tecnología que no ha estado disponible en el mercado. (Spanish)
22 January 2022
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Identifiers
DE_TEMPORARY_7354
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