No label defined (Q3304569)

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Revision as of 17:42, 24 October 2021 by DG Regio (talk | contribs) (‎Created claim: summary (P836): The innovation is based on the separation of finished surfaces (silver, tin, nickel/gold and so-called OSP) on printed circuit board films on printed circuit board films in a technology that has not been available on the market., translated_summary)
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Project Q3304569 in Germany
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English
No label defined
Project Q3304569 in Germany

    Statements

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    169,058.42 Euro
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    211,323.03 Euro
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    80.0 percent
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    1 March 2016
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    31 December 2018
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    ICflex Solution GmbH
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    17033 - Neubrandenburg
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    Die Innovation gründet darauf, mit einem s.g. Horizontal-Plater auf Kundenwunsch geforderte Endoberflächen (Silber, Zinn, Nickel/Gold und s.g. OSP) auf Leiterplattenfolien in einer bisher auf dem Markt nicht verfügbaren Technik abzuscheiden. (German)
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    The innovation is based on the separation of finished surfaces (silver, tin, nickel/gold and so-called OSP) on printed circuit board films on printed circuit board films in a technology that has not been available on the market. (English)
    24 October 2021
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    Identifiers

    DE_TEMPORARY_7354
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