Highly integrated optical detectors using 3D integration techniques (Q3298450): Difference between revisions
Jump to navigation
Jump to search
(Changed label, description and/or aliases in en: translated_label) |
(Changed an Item: Edited by the infer coords bot - inferring coordiantes from postal codes) |
||||||||||
| Property / coordinate location | |||||||||||
52°27'48.35"N, 13°31'17.08"E
| |||||||||||
| Property / coordinate location: 52°27'48.35"N, 13°31'17.08"E / rank | |||||||||||
Normal rank | |||||||||||
Revision as of 07:36, 26 October 2021
Project Q3298450 in Germany
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Highly integrated optical detectors using 3D integration techniques |
Project Q3298450 in Germany |
Statements
267,351.34 Euro
0 references
534,702.68 Euro
0 references
50.0 percent
0 references
1 June 2015
0 references
30 September 2018
0 references
First Sensor AG
0 references
52°27'48.35"N, 13°31'17.08"E
0 references
12459 - Berlin
0 references
Im vorliegenden Projekt sollen aktuelle Forschungserkenntnisse aus den Bereichen der dreidimensionalen (3D) Systemintegration und dem Wafer-Level-Packaging für verschiedene Produkte (insb. optische Detektoren) der Firma First Sensor AG evaluiert und in deren Prozesskette integriert werden. (German)
0 references
In this project, current research findings in the fields of three-dimensional (3D) system integration and wafer-level packaging for various products (especially optical detectors) of First Sensor AG will be evaluated and integrated into their process chain. (English)
24 October 2021
0 references
Identifiers
DE_TEMPORARY_1253
0 references