Q3298450 (Q3298450): Difference between revisions
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(Changed label, description and/or aliases in en: Setting new description) |
(Created claim: summary (P836): In this project, current research findings in the fields of three-dimensional (3D) system integration and wafer-level packaging for various products (especially optical detectors) of First Sensor AG will be evaluated and integrated into their process chain., translated_summary) |
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In this project, current research findings in the fields of three-dimensional (3D) system integration and wafer-level packaging for various products (especially optical detectors) of First Sensor AG will be evaluated and integrated into their process chain. (English) | |||||||||||||||
| Property / summary: In this project, current research findings in the fields of three-dimensional (3D) system integration and wafer-level packaging for various products (especially optical detectors) of First Sensor AG will be evaluated and integrated into their process chain. (English) / rank | |||||||||||||||
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| Property / summary: In this project, current research findings in the fields of three-dimensional (3D) system integration and wafer-level packaging for various products (especially optical detectors) of First Sensor AG will be evaluated and integrated into their process chain. (English) / qualifier | |||||||||||||||
point in time: 24 October 2021
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Revision as of 16:16, 24 October 2021
Project Q3298450 in Germany
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | No label defined |
Project Q3298450 in Germany |
Statements
267,351.34 Euro
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534,702.68 Euro
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50.0 percent
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1 June 2015
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30 September 2018
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First Sensor AG
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12459 - Berlin
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Im vorliegenden Projekt sollen aktuelle Forschungserkenntnisse aus den Bereichen der dreidimensionalen (3D) Systemintegration und dem Wafer-Level-Packaging für verschiedene Produkte (insb. optische Detektoren) der Firma First Sensor AG evaluiert und in deren Prozesskette integriert werden. (German)
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In this project, current research findings in the fields of three-dimensional (3D) system integration and wafer-level packaging for various products (especially optical detectors) of First Sensor AG will be evaluated and integrated into their process chain. (English)
24 October 2021
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Identifiers
DE_TEMPORARY_1253
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