Cluster tool for geometric characterisation of electronic and microsystem components and modules under thermal load (geoCharth) (Q3325969): Difference between revisions
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Revision as of 14:49, 25 October 2021
Project Q3325969 in Germany
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Cluster tool for geometric characterisation of electronic and microsystem components and modules under thermal load (geoCharth) |
Project Q3325969 in Germany |
Statements
400,000.0 Euro
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500,000.0 Euro
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80.0 percent
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24 November 2020
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31 December 2021
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Technische UniversitätDresden
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51°2'57.59"N, 13°44'17.30"E
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Clustertool zur geometrischen Charakterisierung elektronischer und mikrosystemtechnischer Komponenten und Module unter thermischer Last (geoCharth) (German)
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Cluster tool for geometric characterisation of electronic and microsystem components and modules under thermal load (geoCharth) (English)
25 October 2021
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Dresden, Stadt
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Identifiers
672 / 101005369901
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