Q3337303 (Q3337303): Difference between revisions
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(Changed label, description and/or aliases in en: Setting new description) |
(Created claim: summary (P836): Validation of the technological bases for the introduction of a new process for the profiling and functionalisation of ceramic substrates in thick-layer production and FR 4 PCBs in electronic production, translated_summary) |
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Property / summary | |||||||||||||||
Validation of the technological bases for the introduction of a new process for the profiling and functionalisation of ceramic substrates in thick-layer production and FR 4 PCBs in electronic production (English) | |||||||||||||||
Property / summary: Validation of the technological bases for the introduction of a new process for the profiling and functionalisation of ceramic substrates in thick-layer production and FR 4 PCBs in electronic production (English) / rank | |||||||||||||||
Normal rank | |||||||||||||||
Property / summary: Validation of the technological bases for the introduction of a new process for the profiling and functionalisation of ceramic substrates in thick-layer production and FR 4 PCBs in electronic production (English) / qualifier | |||||||||||||||
point in time: 25 October 2021
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Revision as of 08:44, 25 October 2021
Project Q3337303 in Germany
Language | Label | Description | Also known as |
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English | No label defined |
Project Q3337303 in Germany |
Statements
215,275.91 Euro
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269,094.89 Euro
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80.0 percent
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15 June 2016
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14 June 2019
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Lust Hybrid-Technik GmbH
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07629
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Validierung der technologischen Grundlagen zur Einführung eines neuen Verfahrens für die Profilgebung und Funktionalisierung von Keramiksubstraten in der Dickschichtfertigung und von FR 4 Leiterplatten in der Elektronikfertigung (German)
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Validation of the technological bases for the introduction of a new process for the profiling and functionalisation of ceramic substrates in thick-layer production and FR 4 PCBs in electronic production (English)
25 October 2021
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Identifiers
DE_TEMPORARY_39948
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