Q3304569 (Q3304569): Difference between revisions

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(‎Changed label, description and/or aliases in en: Setting new description)
(‎Created claim: summary (P836): The innovation is based on the separation of finished surfaces (silver, tin, nickel/gold and so-called OSP) on printed circuit board films on printed circuit board films in a technology that has not been available on the market., translated_summary)
Property / summary
 
The innovation is based on the separation of finished surfaces (silver, tin, nickel/gold and so-called OSP) on printed circuit board films on printed circuit board films in a technology that has not been available on the market. (English)
Property / summary: The innovation is based on the separation of finished surfaces (silver, tin, nickel/gold and so-called OSP) on printed circuit board films on printed circuit board films in a technology that has not been available on the market. (English) / rank
 
Normal rank
Property / summary: The innovation is based on the separation of finished surfaces (silver, tin, nickel/gold and so-called OSP) on printed circuit board films on printed circuit board films in a technology that has not been available on the market. (English) / qualifier
 
point in time: 24 October 2021
Timestamp+2021-10-24T00:00:00Z
Timezone+00:00
CalendarGregorian
Precision1 day
Before0
After0

Revision as of 17:42, 24 October 2021

Project Q3304569 in Germany
Language Label Description Also known as
English
No label defined
Project Q3304569 in Germany

    Statements

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    169,058.42 Euro
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    211,323.03 Euro
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    80.0 percent
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    1 March 2016
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    31 December 2018
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    ICflex Solution GmbH
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    17033 - Neubrandenburg
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    Die Innovation gründet darauf, mit einem s.g. Horizontal-Plater auf Kundenwunsch geforderte Endoberflächen (Silber, Zinn, Nickel/Gold und s.g. OSP) auf Leiterplattenfolien in einer bisher auf dem Markt nicht verfügbaren Technik abzuscheiden. (German)
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    The innovation is based on the separation of finished surfaces (silver, tin, nickel/gold and so-called OSP) on printed circuit board films on printed circuit board films in a technology that has not been available on the market. (English)
    24 October 2021
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    Identifiers

    DE_TEMPORARY_7354
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