Thermomechanical behaviour of printed circuits in severe environments (Q3696737)
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Project Q3696737 in France
Language | Label | Description | Also known as |
---|---|---|---|
English | Thermomechanical behaviour of printed circuits in severe environments |
Project Q3696737 in France |
Statements
10,000.0 Euro
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20,000.0 Euro
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50.0 percent
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1 March 2016
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31 December 2017
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Université de Lorraine
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57000
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Prédire la durée de vie des circuits imprimés en environnement sévère (French)
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Predict the lifespan of printed circuits in severe environments (English)
22 November 2021
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Vorhersage der Lebensdauer von Leiterplatten in rauen Umgebungen (German)
1 December 2021
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Voorspel de levensduur van gedrukte schakelingen in ernstige omgevingen (Dutch)
6 December 2021
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Prevedere la durata dei circuiti stampati in ambienti severi (Italian)
13 January 2022
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Predecir la vida útil de los circuitos impresos en entornos severos (Spanish)
14 January 2022
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Identifiers
LO0006015
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