Implementation of innovative technology for the production of multiple-layer self-adhesive labels with RFID chips. (Q122920): Difference between revisions

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(‎Removed claim: summary (P836): The project aims at implementing an innovative technology for the production of multi-layered adhesive labels with the option of RFID chips. The project will allow the product to be placed on the market — “Multiple film labels with RFID chips options” (differentiated in terms of number of layers and size). The work will include the implementation, designed by the Applicant, of a technology line for the production of multilayer self-adhesive la...)
(‎Created claim: summary (P836): The aim of the project is to implement innovative technology for the production of multilayer self-adhesive labels with RFID chip option. Thanks to the implementation of the project, the product – “Multi-layer adhesive labels with RFID chip option” (differentiated in terms of the number of layers and sizes) will be placed on the market. The work will include the implementation of a technological line designed by the Applicant for the production...)
Property / summary
 
The aim of the project is to implement innovative technology for the production of multilayer self-adhesive labels with RFID chip option. Thanks to the implementation of the project, the product – “Multi-layer adhesive labels with RFID chip option” (differentiated in terms of the number of layers and sizes) will be placed on the market. The work will include the implementation of a technological line designed by the Applicant for the production of multilayer self-adhesive labels with RFID chip option. It will consist of cutting-out and laminating-positioning sections, coupled with the use of state-of-the-art servomotors and controlled by an IT system. An intelligent material saving system will also be implemented. The project consists of implementing product innovation as well as process and non-technological innovation. (English)
Property / summary: The aim of the project is to implement innovative technology for the production of multilayer self-adhesive labels with RFID chip option. Thanks to the implementation of the project, the product – “Multi-layer adhesive labels with RFID chip option” (differentiated in terms of the number of layers and sizes) will be placed on the market. The work will include the implementation of a technological line designed by the Applicant for the production of multilayer self-adhesive labels with RFID chip option. It will consist of cutting-out and laminating-positioning sections, coupled with the use of state-of-the-art servomotors and controlled by an IT system. An intelligent material saving system will also be implemented. The project consists of implementing product innovation as well as process and non-technological innovation. (English) / rank
 
Normal rank
Property / summary: The aim of the project is to implement innovative technology for the production of multilayer self-adhesive labels with RFID chip option. Thanks to the implementation of the project, the product – “Multi-layer adhesive labels with RFID chip option” (differentiated in terms of the number of layers and sizes) will be placed on the market. The work will include the implementation of a technological line designed by the Applicant for the production of multilayer self-adhesive labels with RFID chip option. It will consist of cutting-out and laminating-positioning sections, coupled with the use of state-of-the-art servomotors and controlled by an IT system. An intelligent material saving system will also be implemented. The project consists of implementing product innovation as well as process and non-technological innovation. (English) / qualifier
 
point in time: 21 October 2020
Timestamp+2020-10-21T00:00:00Z
Timezone+00:00
CalendarGregorian
Precision1 day
Before0
After0

Revision as of 07:19, 21 October 2020

Project in Poland financed by DG Regio
Language Label Description Also known as
English
Implementation of innovative technology for the production of multiple-layer self-adhesive labels with RFID chips.
Project in Poland financed by DG Regio

    Statements

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    1,998,000.0 zloty
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    479,520.0 Euro
    13 January 2020
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    4,440,000.0 zloty
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    1,065,600.0 Euro
    13 January 2020
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    45.0 percent
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    1 February 2016
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    31 December 2017
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    MARCO SPÓŁKA Z OGRANICZONĄ ODPOWIEDZIALNOŚCIĄ
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    50°18'4.0"N, 18°39'44.3"E
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    Celem projektu jest wdrożenie innowacyjnej technologii produkcji wielowarstwowych etykiet samoprzylepnych z opcją chipów RFID. Dzięki realizacji projektu na rynek wprowadzony zostanie produkt - "Wielowarstwowe etykiety samoprzylepne z opcją chipów RFID" (zróżnicowanych pod względem ilości warstw oraz rozmiarów). Prace obejmować będą wdrożenie, zaprojektowanej przez Wnioskodawcę, linii technologicznej do produkcji wielowarstwowych etykiet samoprzylepnych z opcją chipów RFID. Składać się ona będzie z sekcji wycinająco-laminująco-pozycjonujących, sprzężonych ze sobą za pomocą najnowocześniejszych serwomotorów i sterowanych za pomocą systemu IT. Wdrożony zostanie także inteligentny system oszczędzania materiału. Projekt polega na wdrożeniu innowacji produktowej, jaki i procesowej oraz nietechnologicznej. (Polish)
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    The aim of the project is to implement innovative technology for the production of multilayer self-adhesive labels with RFID chip option. Thanks to the implementation of the project, the product – “Multi-layer adhesive labels with RFID chip option” (differentiated in terms of the number of layers and sizes) will be placed on the market. The work will include the implementation of a technological line designed by the Applicant for the production of multilayer self-adhesive labels with RFID chip option. It will consist of cutting-out and laminating-positioning sections, coupled with the use of state-of-the-art servomotors and controlled by an IT system. An intelligent material saving system will also be implemented. The project consists of implementing product innovation as well as process and non-technological innovation. (English)
    21 October 2020
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    Identifiers

    RPSL.03.02.00-24-003H/16
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