Thermomechanical behaviour of printed circuits in severe environments (Q3696737): Difference between revisions
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Thermomechanisches Verhalten von Leiterplatten in rauen Umgebungen | |||
Revision as of 16:05, 26 November 2021
Project Q3696737 in France
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Thermomechanical behaviour of printed circuits in severe environments |
Project Q3696737 in France |
Statements
10,000.0 Euro
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20,000.0 Euro
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50.0 percent
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1 March 2016
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31 December 2017
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Université de Lorraine
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49°6'12.89"N, 6°10'41.41"E
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57000
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Prédire la durée de vie des circuits imprimés en environnement sévère (French)
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Predict the lifespan of printed circuits in severe environments (English)
22 November 2021
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Identifiers
LO0006015
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