Polishing – Platform for surface preparation of direct wafer bonding for new applications in integrated quantum photonics and telecommunications (Q6878851): Difference between revisions

From EU Knowledge Graph
Jump to navigation Jump to search
(‎Created a new Item)
 
(‎Added qualifier: readability score (P590521): 0.0007703226387824)
 
Property / summary: Platform for surface preparation of direct wafer bonding for applications in int. quantum photonics and telecommunications (English) / qualifier
 
readability score: 0.0007703226387824
Amount0.0007703226387824
Unit1

Latest revision as of 18:23, 26 March 2024

Project GENERATED-ID-2014AT16RFOP001-2023-12-5-3390 in Austria
Language Label Description Also known as
English
Polishing – Platform for surface preparation of direct wafer bonding for new applications in integrated quantum photonics and telecommunications
Project GENERATED-ID-2014AT16RFOP001-2023-12-5-3390 in Austria

    Statements

    country
    Austria
    0 references
    budget
    2,500,000.0 Euro
    0 references
    start time
    21 April 2022
    0 references
    end time
    30 November 2023
    0 references
    beneficiary name (string)
    Silicon Austria Labs GmbH
    0 references
    coordinate location

    46°36'39.89"N, 13°50'5.50"E
    inferred from
    Local Administrative Unit
    0 references
    summary
    Plattform zur Oberflächenvorbereitung des direkten Waferbondens für die Anwendungen in der int. Quantenphotonik und Telekommunikation (German)
    0 references
    Plate-forme pour la préparation de surface des wafers directs pour les applications dans la photonique quantique et les télécommunications int. (French)
    0 references
    Piattaforma per la preparazione superficiale dell'incollaggio diretto del wafer per applicazioni in fotonica quantistica e telecomunicazioni (Italian)
    0 references
    Platform közvetlen lemezkötés felületi előkészítésére int. kvantum fotonika- és telekommunikációs alkalmazásokhoz (Hungarian)
    0 references
    Platforma pro povrchovou přípravu přímého lepení destiček pro aplikace v int. kvantové fotonice a telekomunikacích (Czech)
    0 references
    Platform voor oppervlaktevoorbereiding van directe waferbinding voor toepassingen in int. kwantumfotonica en telecommunicatie (Dutch)
    0 references
    Платформа за повърхностна подготовка на директно свързване на вафли за приложения в int. квантовата фотоника и телекомуникациите (Bulgarian)
    0 references
    Platforma tiešās plāksnīšu līmēšanas virsmas sagatavošanai izmantošanai int. kvantu fotonikā un telekomunikācijās (Latvian)
    0 references
    Platform til overfladebehandling af direkte waferbinding til applikationer inden for int. kvantefotonik og telekommunikation (Danish)
    0 references
    Platformă pentru pregătirea suprafeței de lipire directă a plachetelor pentru aplicații în fotonică cuantică și telecomunicații (Romanian)
    0 references
    Platform for surface preparation of direct wafer bonding for applications in int. quantum photonics and telecommunications (English)
    readability score
    0.0007703226387824
    0 references
    Πλατφόρμα για την επιφανειακή προετοιμασία της άμεσης συγκόλλησης πλακιδίων για εφαρμογές στην κβαντική φωτονική και τις τηλεπικοινωνίες (Greek)
    0 references
    Platvorm plaatide otsese liimimise pinna valmistamiseks rakendustes int. kvantfotoonikas ja telekommunikatsioonis (Estonian)
    0 references
    Platforma za površinsko pripravo neposrednega lepljenja rezin za uporabo v int. kvantni fotoniki in telekomunikacijah (Slovenian)
    0 references
    Ardán chun dromchla a ullmhú do nascadh díreach sliseog le haghaidh iarratas i bhfótónaic chandamach agus teileachumarsáid (Irish)
    0 references
    Tiesioginio plokštelių sujungimo paviršiaus paruošimo platforma, skirta naudoti int. kvantinėje fotonikoje ir telekomunikacijose (Lithuanian)
    0 references
    Pjattaforma għall-preparazzjoni tal-wiċċ tal-irbit dirett tal-wejfers għal applikazzjonijiet f’fotonika kwantistika u telekomunikazzjonijiet int. (Maltese)
    0 references
    Plattform för ytberedning av direkt waferbindning för tillämpningar inom int. kvantfotonik och telekommunikation (Swedish)
    0 references
    Platforma za površinske pripreme izravnog vezivanja pločica za primjene u int. kvantnoj fotonici i telekomunikacijama (Croatian)
    0 references
    Plataforma para preparação de superfície de ligação direta de bolachas para aplicações em fotónica quântica e telecomunicações (Portuguese)
    0 references
    Platforma na povrchovú prípravu priameho lepenia doštičiek pre aplikácie v oblasti kvantovej fotoniky a telekomunikácií (Slovak)
    0 references
    Alusta suoran kiekkojen liimauksen pintakäsittelyyn int. kvanttifotoniikan ja televiestinnän sovelluksiin (Finnish)
    0 references
    Plataforma para la preparación de superficies de unión directa de obleas para aplicaciones en fotónica cuántica y telecomunicaciones (Spanish)
    0 references
    date of first ingestion
    7 December 2023
    0 references

    Identifiers

    Austrian Kohesio ID
    GENERATED-ID-2014AT16RFOP001-2023-12-5-3390
    0 references
     
    Retrieved from "https://linkedopendata.eu/w/index.php?title=Item:Q6878851&oldid=42131970"