Development of a breakthrough printing technology for micrometric 3D conductive structures using an innovative head capable of printing on non-planar substrates and compatible ink, for use in printed electronics (Q4417960): Difference between revisions
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Development of a breakthrough printing technology for micrometric 3D conductive structures using an innovative head capable of printing on non-planar substrates and compatible ink, for use in printed electronics | |||||||||||||||
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Number_reference_aid_programme: SA.41471(2015/X) Purpose of public aid: Article 25 of Regulation (EC) No 651/2014 of 17 June 2014 declaring certain categories of aid compatible with the internal market in the application of Articles 107 and 108 of the Treaty That’s it. EU L 187/1 of 26.06.2014). The subject of the project is the development and implementation of a new technology for precise printing of ultrathin conductive structures on three-dimensional substrates for applications in printed electronics. The motivation for this project is to fill the existing technological gap: printing on complex substrates, typical of modern electronic circuits, requires a high viscosity paste. Only such paste allows printing on three-dimensional elements of the substrate and simultaneous printing on surfaces with very different wetting angles (e.g. metal-insulator connector). At the same time, the printing technologies present on the market using high concentration inks do not allow the printing of appropriately thin structures (less than 20 um), which is a barrier to miniaturisation of modern printed electronic circuits. In this project, we propose a solution to this problem by creating an innovative depositing head, compatible high-concentrated pastes based on silver and copper nanoparticles, and a head control system based on machine learning algorithms. The combination of these three elements is designed to enable the printing of precise conductive structures on complex topographs. During the implementation of this project, we will focus on technological challenges, divided into four categories: 1) the achievement of the intended geometric parameters of printed structures, including width, height and their ratio; 2) printing on three-dimensional substrates; 3) achieve mechanical stability of printed structures, including avoiding empty spaces between the ground and the printed structure; (...). (English) | |||||||||||||||
| Property / summary: Number_reference_aid_programme: SA.41471(2015/X) Purpose of public aid: Article 25 of Regulation (EC) No 651/2014 of 17 June 2014 declaring certain categories of aid compatible with the internal market in the application of Articles 107 and 108 of the Treaty That’s it. EU L 187/1 of 26.06.2014). The subject of the project is the development and implementation of a new technology for precise printing of ultrathin conductive structures on three-dimensional substrates for applications in printed electronics. The motivation for this project is to fill the existing technological gap: printing on complex substrates, typical of modern electronic circuits, requires a high viscosity paste. Only such paste allows printing on three-dimensional elements of the substrate and simultaneous printing on surfaces with very different wetting angles (e.g. metal-insulator connector). At the same time, the printing technologies present on the market using high concentration inks do not allow the printing of appropriately thin structures (less than 20 um), which is a barrier to miniaturisation of modern printed electronic circuits. In this project, we propose a solution to this problem by creating an innovative depositing head, compatible high-concentrated pastes based on silver and copper nanoparticles, and a head control system based on machine learning algorithms. The combination of these three elements is designed to enable the printing of precise conductive structures on complex topographs. During the implementation of this project, we will focus on technological challenges, divided into four categories: 1) the achievement of the intended geometric parameters of printed structures, including width, height and their ratio; 2) printing on three-dimensional substrates; 3) achieve mechanical stability of printed structures, including avoiding empty spaces between the ground and the printed structure; (...). (English) / rank | |||||||||||||||
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| Property / summary: Number_reference_aid_programme: SA.41471(2015/X) Purpose of public aid: Article 25 of Regulation (EC) No 651/2014 of 17 June 2014 declaring certain categories of aid compatible with the internal market in the application of Articles 107 and 108 of the Treaty That’s it. EU L 187/1 of 26.06.2014). The subject of the project is the development and implementation of a new technology for precise printing of ultrathin conductive structures on three-dimensional substrates for applications in printed electronics. The motivation for this project is to fill the existing technological gap: printing on complex substrates, typical of modern electronic circuits, requires a high viscosity paste. Only such paste allows printing on three-dimensional elements of the substrate and simultaneous printing on surfaces with very different wetting angles (e.g. metal-insulator connector). At the same time, the printing technologies present on the market using high concentration inks do not allow the printing of appropriately thin structures (less than 20 um), which is a barrier to miniaturisation of modern printed electronic circuits. In this project, we propose a solution to this problem by creating an innovative depositing head, compatible high-concentrated pastes based on silver and copper nanoparticles, and a head control system based on machine learning algorithms. The combination of these three elements is designed to enable the printing of precise conductive structures on complex topographs. During the implementation of this project, we will focus on technological challenges, divided into four categories: 1) the achievement of the intended geometric parameters of printed structures, including width, height and their ratio; 2) printing on three-dimensional substrates; 3) achieve mechanical stability of printed structures, including avoiding empty spaces between the ground and the printed structure; (...). (English) / qualifier | |||||||||||||||
point in time: 21 October 2022
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Revision as of 12:20, 21 October 2022
Project Q4417960 in Poland
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Development of a breakthrough printing technology for micrometric 3D conductive structures using an innovative head capable of printing on non-planar substrates and compatible ink, for use in printed electronics |
Project Q4417960 in Poland |
Statements
7,653,510.3 zloty
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1,701,375.34 Euro
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11,614,839.84 zloty
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2,581,978.9 Euro
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65.89 percent
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1 October 2020
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30 September 2023
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XTPL SA
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Numer_referencyjny_programu_pomocowego: SA.41471(2015/X) Przeznaczenie_pomocy_publicznej: art. 25 rozporządzenia KE nr 651/2014 z dnia 17 czerwca 2014 r. uznające niektóre rodzaje pomocy za zgodne z rynkiem wewnętrznym w stosowaniu art. 107 i 108 Traktatu (Dz. Urz. UE L 187/1 z 26.06.2014). Przedmiotem projektu jest opracowanie i implementacja nowej technologii precyzyjnego druku ultracienkich struktur przewodzących na trójwymiarowych podłożach do zastosowań w elektronice drukowanej. Motywacją dla tego projektu jest wypełnienie istniejącej luki technologicznej: druk na skomplikowanych podłożach, typowych dla współczesnych układów elektronicznych, wymaga pasty o wysokiej lepkości. Tylko taka pasta pozwala na wykonanie nadruku na trójwymiarowych elementach podłoża oraz na jednoczesne drukowanie na powierzchniach o bardzo różnych kątach zwilżania (np. złącze metal-izolator). Jednocześnie obecne na rynku technologie druku wykorzystujące tusze o wysokim stężeniu nie pozwalają na druk odpowiednio cienkich struktur (poniżej 20 um), co stanowi barierę w miniaturyzacji współczesnych drukowanych układów elektronicznych. W opisywanym projekcie proponujemy rozwiązanie tego problemu, polegające na stworzeniu innowacyjnej głowicy deponującej, kompatybilnych z nią wysoko-stężonych past opartych na nanocząstkach srebra i miedzi, oraz systemu sterowania głowicą, opartego na algorytmach uczenia maszynowego. Kombinacja tych trzech elementów ma umożliwić druk precyzyjnych struktur przewodzących na skomplikowanych topografiach. Podczas realizacji tego projektu będziemy koncentrować się na wyzwaniach technologicznych, podzielonych na cztery kategorie: 1) osiągnięcie zamierzonych parametrów geometrycznych wydrukowanych struktur, w tym szerokości, wysokości i ich stosunku; 2) druk na trójwymiarowych podłożach; 3) osiągnięcie stabilności mechanicznej wydrukowanych struktur, w tym uniknięcie pustych przestrzeni pomiędzy podłożem a nadrukowaną strukturą; (...). (Polish)
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Number_reference_aid_programme: SA.41471(2015/X) Purpose of public aid: Article 25 of Regulation (EC) No 651/2014 of 17 June 2014 declaring certain categories of aid compatible with the internal market in the application of Articles 107 and 108 of the Treaty That’s it. EU L 187/1 of 26.06.2014). The subject of the project is the development and implementation of a new technology for precise printing of ultrathin conductive structures on three-dimensional substrates for applications in printed electronics. The motivation for this project is to fill the existing technological gap: printing on complex substrates, typical of modern electronic circuits, requires a high viscosity paste. Only such paste allows printing on three-dimensional elements of the substrate and simultaneous printing on surfaces with very different wetting angles (e.g. metal-insulator connector). At the same time, the printing technologies present on the market using high concentration inks do not allow the printing of appropriately thin structures (less than 20 um), which is a barrier to miniaturisation of modern printed electronic circuits. In this project, we propose a solution to this problem by creating an innovative depositing head, compatible high-concentrated pastes based on silver and copper nanoparticles, and a head control system based on machine learning algorithms. The combination of these three elements is designed to enable the printing of precise conductive structures on complex topographs. During the implementation of this project, we will focus on technological challenges, divided into four categories: 1) the achievement of the intended geometric parameters of printed structures, including width, height and their ratio; 2) printing on three-dimensional substrates; 3) achieve mechanical stability of printed structures, including avoiding empty spaces between the ground and the printed structure; (...). (English)
21 October 2022
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WOJ.: DOLNOŚLĄSKIE, POW.: Wrocław
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Identifiers
POIR.01.01.01-00-1852/20
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